第11世代Intel CPU搭載 高耐久ファンレスシステム – EMS-TGL
第11世代Intel TigerLakeプロセッサー搭載、高耐久ファンレスシステム
特徴
- 第11世代Intel®Core™シリーズ BGAプロセッサーオンボード搭載
- 260ピン SO-DIMMソケット x2（最大DDR4 3200MT/s 64GBまで対応）
- USB3.1 x4、DPポート、HDMI、COM x2、LAN x2、8bit GPIO
- 5G（Sub-6G）モジュール、M.2 NVMe SSD Gen. III x 4対応
- 2.5Gigabitイーサネット搭載
- 0～70℃（標準仕様）/-40～70℃（温拡仕様）のファンレス動作
- CE、FCC class B、IP50規格準拠
- +9～32Vの広範囲DC電源入力
- HW TPM2.0対応
- vPro対応
スペック
| System Information | |
| Processor | On board 11th Gen. Intel® Core™ i7/i5/i3 BGA Processor Intel® Core™ i7- 1185GRE (15W, 12M Cache, up to 2.80 GHz), WT Intel® Core™ i5- 1145GRE (15W, 8M Cache, up to 2.60 GHz), WT Intel® Core™ i3- 1115GRE (15W, 6M Cache, up to 3.00 GHz), WT Intel® Core™ i7- 1185G7E (15W, 12M Cache, up to 2.80 GHz), ST Intel® Core™ i5- 1145G7E (15W, 8M Cache, up to 2.60 GHz), ST Intel® Core™ i3- 1115G4E (15W, 6M Cache, up to 3.00 GHz), ST |
| System Memory | 2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200 MT/s |
| I/O Chipset | EC ITE IT8528E |
| BIOS Information | AMI uEFI BIOS 256 Mbit SPI Flash ROM |
| Watchdog Timer | H/W Reset, 1sec. ~ 65535sec. |
| H/W Status Monitor | CPU & system temperature monitoring and Voltages monitoring |
| SBC | EBM-TGLS |
| Expansion | |
| Expansion | 1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIeIII x1/ USB3.1 and SIM slot1 1 x M.2 Key-E 2230 for Wi-Fi & BT Module(CNVi) 1 x IET interface (1 x DDI, 2x PCIe3 x 2, 3 x USB2.0, 1 x Line-Out(R/L), 1 x SMBus, LPC) |
| Storage | |
| Storage | 1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD) 1 x M.2 Key-B 2242, support SATA (share with expansion slot) |
| I/O | |
| USB Port | 2 x USB 3.1 Gen.2 (10Gbp/s) 2 x USB 3.1 Gen.1 (5Gbp/s) |
| COM Port | 2 x COM RS232/422/485 (select via BIOS, auto flow control via HW) |
| GPIO | 1 x 8-bit GPIO (DB9) |
| SIM Slot | 1 x internal SIM slot |
| Antenna | 8 x Antenna with dust cover (6 x LTE+GPS / 2 x Wifi) |
| Wire-Control Power On/Off | 2-Pin Terminal Block |
| Display | |
| Graphic Chipset | Intel® Iris® Xe Graphics (i7-1185GRE/i5-1145GRE/i7-1185G7E/i5-1145G7E) Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115GRE/i3-1115G4E) |
| Spec. & Resolution | DP++ 1.4: 4096×2304 @ 60Hz HDMI 2.0b : Max. resolution 4096×2304 @ 60Hz |
| Multiple Display | Dual Displays |
| Audio | |
| Audio Codec | Realtek ALC888S HD codec |
| Audio Interface | Mic-In, Line-Out |
| Certifications | |
| Certification Information | CE FCC Class B |
| Ethernet | |
| LAN Chipset | 1 x Intel® I225-LM 1 x Intel® I219-LM |
| Ethernet Interface | 1 x 10/100/1000/2.5G Base-Tx GbE compatible 1 x 10/100/1000Base-Tx GbE compatible. |
| LAN Port | 2 x RJ-45 |
| Power Requirement | |
| DC Input | DC in 12/24V (+9V ~ +32V), wide voltage single power input TVS component for surge protection Reverse current/voltage protection (Max. Currency: 13A) |
| DC Input Connector | 3-Pin Terminal Block (V+. V-, GND) |
| ACPI | Single power ATX Support S0,S3, S4, S5 ACPI 5.0 Compliant |
| Power Mode | AT/ATX (ATX is default setting) |
| Mechanical & Environmental | |
| Operating Temperature | -40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku 0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku |
| Storage Temperature | -40°C ~ 75°C (-40°F ~ 167°F) |
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing |
| Dimension (W x L x H) | 240mm x 150mm x 48 mm (Standard) 240mm x 150mm x 69 mm (w/ IET module) |
| Weight | 2.1 kg (System) 2.9 kg (w_Package) |
| Vibration Test | With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis |
| Shock Test | With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms |
| IP Rating | IP 50 |
| Mounting Kit | Wall mount kit (standard) DIN RAIL (optional) |
| Software Support | |
| OS Information | Win 10 64bit Linux |
| Ordering Information | |
| Ordering Information |
EMS-TGL
11th Gen Intel® Core™ Processor i7/i5/i3 Fanless Rugged Embedded System EMS-TGL-W85-A1-1R (i7-1185GRE)
EMS-TGL-W45-A1-1R (i5-1145GRE)
EMS-TGL-W15-A1-1R (i3-1115GRE)
EMS-TGL-S85-A1-1R (i7-1185G7E)
EMS-TGL-S45-A1-1R (i5-1145G7E)
EMS-TGL-S15-A1-1R (i3-1115G4E)
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