Intel CoffeLakeプロセッサー搭載 COMeモジュール – ESM-CFH
PICMG COM R3.0 Type 6 module with Intel® 9th/8th Generation Xeon®/Core™ i7 / i5 / i3 Processors with CM246/QM370 Chipset
特徴
- PICMG COM R3.0 Type 6 module with Intel® 9th/8th Generation Xeon®/Core™ i7 / i5 / i3 Processors
- Up to 3x 260-pin DDR4 non-ECC/ECC 2400/2133 SO-DIMM with up to 96 GByte
- Dual-channel 18/24-bit LVDS, VGA, DP/HDMI/DVI, (eDP Option)
- Flexible I/O support with 4 USB3.2 Gen.2, 8 USB 2.0, Gen3 PEGx16, 8 PCIex1 & 4 SATAIII
- Intel® I219LM Gigabit Ethernet PHY
- 9V~19V Wide Range Voltage Input
- TPM 2.0
- AMT 12.0 support
スペック
| System | |
| Processor | Mobile 9th Generation Intel® Xeon®, Core™, Pentium® and Celeron® Processors – 14nm process Xeon® E-2276ME 45W (35W cTDP), 6C/GT2 (ECC/non-ECC) Xeon® E-2276ML* 25W, 6C/GT2 (ECC/non-ECC) Xeon® E-2254ME* 45W (35W cTDP), 4C/GT2 (ECC/non-ECC) Xeon® E-2254ML* 25W, 4C/GT2 (ECC/non-ECC) Core™ i7-9850HE 45W (35W cTDP), 6C/GT2 (non-ECC) Core™ i7-9850HL* 25W, 6C/GT2 (non-ECC) Core™ i3-9100HL 25W, 4C/GT2 (ECC/non-ECC) Celeron® G4930E* 35W, 2C/GT1 (ECC/non-ECC) Celeron® G4932E* 25W, 2C/GT1 (ECC/non-ECC) Mobile 8th Generation Intel Xeon® and Core™ Processors – 14nm process Xeon® E-2176M* 45W (35W cTDP), 6C/GT2 (ECC/non-ECC) Core™ i7-8850H* 45W (35W cTDP), 6C/GT2 (non-ECC) Core™ i5-8400H 45W (35W cTDP), 4C/GT2 (non-ECC) Core™ i3-8100H* 45W (35W cTDP), 4C/GT2 (ECC/non-ECC) *SKU is project based support. Please contact sales for details |
| System Chipset | CM246 (supports ECC memory, Intel® AMT and PEG configuration) QM370 (supports Intel® AMT and PEG configuration) |
| System Memory | Up to 3x 260-pin DDR4-2400/2133 SO-DIMM with up to 96 GByte Note:ECC supported only on specific models with Xeon & i3 CPU paired with CM246 supports both ECC and non-ECC memory) |
| I/O Chip | EC(IT8528E) |
| BIOS | AMI uEFI BIOS, 128 Mbit SPI Flash ROM iAMT 12.0 supported (only on specific models with Xeon/i7/i5 SKU) |
| Watchdog Timer | H/W Reset, 1sec. ~ 65535sec. and 1sec./step |
| H/W Status Monitor | Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control |
| Expansion | |
| Expansion | 1xPCIe x16 Gen3 (configurable to 1 PCIe x16, 2 PCIe x8, or 1 PCIe x8 + 2 PCIe x4) 8xPCIe x1, configurable to x4 or x2 *6 x PCIEx1 (PCIE0~3 w/RST , PCIE4,5) *2 x PCIEx1 (PCIE6, PCIE7) |
| I/O | |
| USB | 4 x USB 3.2 Gen.2 (10 Gbps)/ USB USB 3.2 Gen.1 8 x USB 2.0 (EHCI) |
| MIO | 4 x SATAIII 6.0Gb/s (Support RAID0,1,5,10) LPC, I2C, SPI, SMBus, 2 x UART(2-wire), SDIO (optional) |
| GPIO | 8bit GPIO (Share with SDIO, Optional), WDG/HW monitor/FAN |
| HDMI | HDMI 1.4 |
| Display | |
| Chipset | Intel® Coffee Lake Processor integrated Graphics |
| Resolution | eDP 1.4(optional): 4096×2304 @60Hz optional (only one display output) HDMI 1.4: 4096×2160 @30Hz (only one display output) DP 1.2: 4096×2304 @60Hz (only one display output) LVDS(via eDP-to-LVDS IC): 1920×1080 @60Hz VGA(via DP-to-VGA IC): 1920×1080 @60Hz |
| Multiple Display | supporting 3 independent and simultaneous display LVDS(eDP)+ VGA(HDMI)+DDI(HDMI or DP) |
| Interface | Dual-channel 18/24-bit LVDS (LVDS via CH7511B) |
| Audio | |
| Audio Codec | Intel HD audio I/F |
| Ethernet | |
| Chipset | Intel I219LM |
| Ethernet Interface | 10/100/1000 GbE connection |
| Mechanical & Environmental | |
| Power Requirement | +9~ +19V |
| ACPI | Single power ATX Support S0, S3, S4, S5 ACPI 4.0 Compliant |
| Power Type | AT/ATX |
| Operating Temperature | 0 ~ 60 °C (32 ~ 140 °F) |
| Storage Temperature | -40°C ~ 75°C (-40°F ~ 167°F) |
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing |
| Dimension (L x W) | 125*95 mm (3.74” x 4.92”) |
| Weight | 0.44lbs(0.2kg) |
| Software Support | |
| OS Information | Microsoft® Windows 10 64-bit Linux |